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UbiComp2023顶会

ThermoFit: Thermoforming Smart Orthoses via Metamaterial Structures for Body-Fitting and Component-Adjusting

Guanyun Wang, Yue Yang, Mengyan Guo, Kuangqi Zhu, Zihan Yan, Qiang Cui, Zihong Zhou, Junzhe Ji, Jiaji Li, Danli Luo, Deying Pan, Yitao Fan

2023年份
22被引次数
3顶会引用

摘要

Smart orthoses hold great potential for intelligent rehabilitation monitoring and training. However, most of these electronic assistive devices are typically too difficult for daily use and challenging to modify to accommodate variations in body shape and medical needs. For existing clinicians, the customization pipeline of these smart devices imposes significant learning costs. This paper introduces ThermoFit, an end-to-end design and fabrication pipeline for thermoforming smart orthoses that adheres to the clinically accepted procedure. ThermoFit enables the shapes and electronics positions of smart orthoses to conform to bodies and allows rapid iteration by integrating low-cost Low-Temperature Thermoplastics (LTTPs) with custom metamaterial structures and electronic components. Specifically, three types of metamaterial structures are used in LTTPs to reduce the wrinkles caused by the thermoforming process and to permit component position adjustment and joint movement. A design tool prototype aids in generating metamaterial patterns and optimizing component placement and circuit routing. Three applications show that ThermoFit can be shaped on bodies to different wearables. Finally, a hands-on study with a clinician verifies the user-friendliness of thermoforming smart orthosis, and technical evaluations demonstrate fabrication efficiency and electronic continuity.

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