Bridging Efficiency and Scalability in Llm System Via 3D Hybrid Pim With 2D in-Transit Computation
Hongyi Li, Songchen Ma, Huanyu Qu, Weihao Zhang, Jia Chen, Junfeng Lin, Fengbin Tu, Rong Zhao
摘要
Large Language Models (LLMs) have transformed society, but their computational and energy needs hinder efficient inference. The memory wall, the growing processor-memory speed disparity, remains a critical bottleneck for LLM. While Process-in-Memory (PIM) architectures address this challenge by co-locating computation with memory, achieving 5-20 × higher bandwidth than GPUs, existing scalable PIM solutions face critical trade-offs in flexibility, capacity, and efficiency when handling LLMs' dynamic memory-compute patterns and operator diversity. DRAM-PIM suffers from inter-bank communication overhead despite its vector parallelism. SRAM-PIM offers sub10ns latency for matrix operation but is constrained by limited capacity. This work introduces CompAir, a scalable PIM architecture that integrates DRAM-PIM and SRAM-PIM with hybrid bonding, enabling efficient linear computations while unlocking multi-granularity data pathways. We further develop CompAirNoC, an advanced network-on-chip (NoC) with an embedded arithmetic logic unit that performs non-linear operations during data movement. Such a design offloads the centralized communication bottleneck in the channel level to distributed banks, simultaneously reducing communication overhead and area cost for scalability. Finally, we develop a hierarchical Instruction Set Architecture that ensures both flexibility and programmability of the hybrid PIM. Experiments show CompAir delivers 1.83-7.98× faster prefill and 1.95 - 6.28 × faster decoding versus state-ofthe-art PIM designs, with 3.52 × lower energy than GPU-PIM hybrids. This work presents the first systematic exploration of hybrid DRAM-PIM and SRAM-PIM architectures with innetwork computation, paving the way towards a scalable PIM system for LLM inference.
问问这篇 Paper
问问你的智能体。
Lune 读过与它相关的顶会 Paper,每个回答都会注明依据哪几篇。
相关 Paper
- FACIL: Flexible DRAM Address Mapping for SoC-PIM Cooperative On-device LLM InferenceSeong Hoon Seo, Junghoon Kim, Donghyun Lee, Seonah Yoo 等HPCA 2025 · 被引用 7 次
- McPAL: Scaling Unstructured Sparse Inference with Multi-Chiplet HBM-PIM Architecture for LLMsShiwei Liu, Zhirui Huang, Jiangnan Yu, Qi Liu 等DAC 2025 · 被引用 2 次
- Ouroboros: Wafer-Scale SRAM CIM with Token-Grained Pipelining for Large Language Model InferenceYiqi Liu, Yudong Pan, Mengdi Wang, Shixin Zhao 等ASPLOS 2026 · 被引用 1 次
- Near-Memory LLM Inference Processor based on 3D DRAM-to-logic Hybrid BondingSanghyeok Han, Byungkuk Yoon, Gyeonghwan Park, Choungki Song 等DAC 2025 · 被引用 4 次
- Lincoln: Real-Time 50 100B LLM Inference on Consumer Devices with LPDDR-Interfaced, Compute-Enabled Flash MemoryWeiyi Sun, Mingyu Gao, Zhaoshi Li, Aoyang Zhang 等HPCA 2025 · 被引用 11 次
