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DAC2025顶会

McPAL: Scaling Unstructured Sparse Inference with Multi-Chiplet HBM-PIM Architecture for LLMs

Shiwei Liu, Zhirui Huang, Jiangnan Yu, Qi Liu, Chixiao Chen

2025年份
2被引次数
1顶会引用

摘要

Large language models (LLMs) have gained significant attention recently. However, executing LLM is memory-bound due to the extensive memory accesses. Process-in-memory (PIM) emerges as an energy-efficient solution for LLMs, delivering high memory bandwidth and compute parallelism. Nevertheless, the trend towards larger LLMs introduces escalating memory footprint challenges for monolithic PIM chips. This paper proposes McPAL, which tackles this challenge by emphasizing unstructured sparse compute within PIM and hierarchical multi-chiplet scaling. McPAL decomposes arbitrary sparse weight matrix into multiple irregular sparse vectors. The non-skipped computations in each vector are then routed via an in-memory butterfly network to the standard PIM array, enhancing the PIM utilization. In addition, we scale McPAL vertically by strategically organizing the 3D-HBM hierarchy to minimize the internal long-distance data travel. Meanwhile, a 2.5D IO chiplet scales McPAL horizontally, reducing die-to-die (D2D) data transfer and ensuring sparse workload balance. We conducted extensive experiments from Llama-7B to Llama-70B. The results show that McPAL achieves 1.57×1.57 \times to 3.12×3.12 \times speedup and 10.43×10.43 \times to 35.66×35.66 \times energy efficiency over Nvidia A100 GPU. Compared to SOTAs, McPAL also achieves 1.08×1.08 \times to 2.15×2.15 \times speedup and 1.65×1.65 \times to 5.14×5.14 \times energy efficiency.

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McPAL: Scaling Unstructured Sparse Inference with Multi-Chiplet HBM-PIM Architecture for LLMs | Lune Research