Fibercuit: Prototyping High-Resolution Flexible and Kirigami Circuits with a Fiber Laser Engraver
Zeyu Yan, Anup Sathya, Sahra Yusuf, Jyh-Ming Lien, Huaishu Peng
摘要
Prototyping compact devices with unique form factors often requires the PCB manufacturing process to be outsourced, which can be expensive and time-consuming. In this paper, we present Fibercuit, a set of rapid prototyping techniques to fabricate high-resolution, flexible circuits on-demand using a fiber laser engraver. We showcase techniques that can laser cut copper-based composites to form fine-pitch conductive traces, laser fold copper substrates that can form kirigami structures, and laser solder surface-mount electrical components using off-the-shelf soldering pastes. Combined with our software pipeline, an end user can design and fabricate flexible circuits which are dual-layer and three-dimensional, thereby exhibiting a wide range of form factors. We demonstrate Fibercuit by showcasing a set of examples, including a custom dice, flex cables, custom end-stop switches, electromagnetic coils, LED earrings and a circuit in the form of kirigami crane.
问问这篇 Paper
智能体会读完全文。
Lune 把这篇 Paper 索引到了每一个公式,引用它的顶会 Paper 也一样。你提问,回答直接引用原文。
引用它的顶会 Paper9
- SolderlessPCB: Reusing Electronic Components in PCB Prototyping through Detachable 3D Printed HousingsZeyu Yan, Jiasheng Li, Zining Zhang, Huaishu PengCHI 2024 · 被引用 19 次
- FlexBoard: A Flexible Breadboard for Interaction Prototyping on Curved and Deformable SurfacesDonghyeon Ko, Yoonji Kim, Junyi Zhu, Michael Wessely 等CHI 2023 · 被引用 13 次
- PCB Renewal: Iterative Reuse of PCB Substrates for Sustainable Electronic MakingZeyu Yan, Advait Vartak, Jiasheng Li, Zining Zhang 等CHI 2025 · 被引用 10 次
- 3D Printing Magnetophoretic DisplaysZeyu Yan, Hsuanling Lee, Liang He, Huaishu PengUIST 2023 · 被引用 9 次
- PCBend: Light Up Your 3D Shapes With Foldable Circuit BoardsMarco Freire, Manas Bhargava, Camille Schreck, Pierre-Alexandre Hugron 等SIGGRAPH 2023 · 被引用 5 次
它引用的顶会 Paper9
- MetaSense: Integrating Sensing Capabilities into Mechanical MetamaterialJun Gong, Olivia Seow, Cedric Honnet, Jack Forman 等UIST 2021 · 被引用 91 次
- Sprayable User Interfaces: Prototyping Large-Scale Interactive Surfaces with Sensors and DisplaysMichael Wessely, Ticha Sethapakdi, Carlos Castillo, Jackson C. Snowden 等CHI 2020 · 被引用 74 次
- LaserFactory: A Laser Cutter-based Electromechanical Assembly and Fabrication Platform to Make Functional Devices & RobotsMartin Nisser, Christina Chen Liao, Yuchen Chai, Aradhana Adhikari 等CHI 2021 · 被引用 53 次
- MorphingCircuit: An Integrated Design, Simulation, and Fabrication Workflow for Self-morphing ElectronicsGuanyun Wang, Fang Qin, Haolin Liu, Ye Tao 等UbiComp 2021 · 被引用 51 次
- CurveBoards: Integrating Breadboards into Physical Objects to Prototype Function in the Context of FormJunyi Zhu, Lotta-Gili Blumberg, Yunyi Zhu, Martin Nisser 等CHI 2020 · 被引用 45 次
相关 Paper
- LaCir: A multilayered laser-cuttable material to co-fabricate circuitry and structural componentsNiels Christian Buch, Carlos Tejada, Daniel Ashbrook, Valkyrie SavageCHI 2024 · 被引用 4 次
- MechCircuit: Augmenting Laser-Cut Objects with Integrated Electronics, Mechanical Structures and MagnetsShuyue Feng, Cheng Yao, Weijia Lin, Jiayu Yao 等CHI 2023 · 被引用 12 次
- KiriInflate: Fabricating Cross-Scale Inflatables with Large Contraction and Tunable Stretchability for Tangible InteractionYue Yang, Chuang Chen, Yulu Chen, Ge Gao 等UIST 2025 · 被引用 1 次
- Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bendingFreddie Taewoo Hong, Connor W. Myant, David E. BoyleCHI 2021 · 被引用 40 次
- LiqMetCraft: A Toolkit for Creating Papercraft with Embedded Electronics By Directly Cutting and Folding Liquid-Metal-Dyed Paper-like FabricQi Zhang, Shuwen Jiang, Zeshui Li, Yong Lyu 等CHI 2026 · 被引用 1 次
