Heterogeneous Die-to-Die Interfaces: Enabling More Flexible Chiplet Interconnection Systems

The chiplet architecture is one of the emerging methodologies and is believed to be scalable and economical. However, most current multi-chiplet systems are based on one uniform die-to-die interface, which severely limits flexibility. First, any interface has specific applicable workloads/scales/scenarios; therefore, chiplets with a uniform interface cannot be freely reused in different systems. Second, since modern computing systems must deal with complex and mixed tasks, the uniform interface does not cope well with flexible workloads, especially for large-scale systems.