ProForm: Solder-Free Circuit Assembly Using Thermoforming

Figure 1: ProForm-A thermoforming approach for solder-free prototyping of electronic circuits. (a) The process involves assembling SMD components on a PCB and thermoforming a protective thermoplastic layer to secure them. The ProFormed circuit is immediately functional. Later, the thermoplastic layer can be removed to enable the reuse of components. (b, c) ProForm facilitates seamless integration of electronics into interactive physical objects, (d) without compromising aesthetics. (e) ProForm supports alternative circuit substrates, such as paper.