3D-PATH: A Hierarchy LUT Processing-in-memory Accelerator with Thermal-aware Hybrid Bonding Integration

LUT-based processing-in-memory (PIM) architectures enable generalpurpose in-situ computing by retrieving precomputed results.However, they suffer from limited computing precision, redundancy, and high latency of off-table access.To address these challenges, we present 3D-PATH, a novel PIM architecture that employs 3D hybrid bonding to integrate a DRAM-LUT, enhancing system capacity and reducing access latency.To further optimize efficiency, 3D-PATH introduces a hierarchical fast-LUT design that reduces storage redundancy and accelerates computation.Additionally, 3D-PATH extends computing precision by efficiently supporting floating-point operations via representation transformation and parallel interleaving banks.While hybrid bonding offers significant benefits, it induces heat dissipation challenges.To address this, we implement thermal-aware hardware that ensures the DRAM Die temperature maintains below the threshold of 85°C.Evaluations on arithmetic and AI workloads demonstrate that 3D-PATH achieves up to 12.68× higher throughput than GPUs and 2.27-7.54×over prior LUT-PIMs, while delivering a 12.24× improvement in floating-point energy efficiency over GPU and 2.13× over a 3D baseline.