3D-Carbon: An Analytical Carbon Modeling Tool for 3D and 2.5D Integrated Circuits
Yujie Zhao, Yang Katie Zhao, Cheng Wan, Yingyan (Celine) Lin
Abstract
Environmental sustainability is crucial for Integrated Circuits (ICs) across their lifecycle, particularly in manufacturing and use. Meanwhile, ICs using 3D/2.5D integration technologies have emerged as promising solutions to meet the growing demands for computational power. However, there is a distinct lack of carbon modeling tools for 3D/2.5D ICs. Addressing this, we propose 3D-Carbon, an analytical carbon modeling tool designed to quantify the carbon emissions of 3D/2.5D ICs throughout their life cycle. 3D-Carbon factors in both potential savings and overheads from advanced integration technologies, considering practical deployment constraints like bandwidth. We validate 3D-Carbon's accuracy against established baselines and illustrate its utility through case studies in autonomous vehicles. We believe that 3D-Carbon lays the initial foundation for future innovations in developing environmentally sustainable 3D/2.5D ICs. Our open-source code is available at https://github.com/UMN-ZhaoLab/3D-Carbon.
Ask about this paper
Your agent reads all of it.
Lune indexed this paper to the last equation, along with the top-tier papers that cite it. Ask a question and the answer quotes them.
Your agent calls
Luneget_paper_fulltext
Free to start. No credit card required.
Terminal
Install the CLIlune papers fulltext a6cd6066-6931-4cf3-81e6-636689dabd0dCited by top-tier papers2
- GreenFPGA: Evaluating FPGAs as Environmentally Sustainable Computing SolutionsChetan Choppali Sudarshan, Aman Arora, Vidya A. ChhabriaDAC 2024 · 8 citations
- Hardwired-Neuron Language Processing Units as General-Purpose Cognitive SubstratesYang Liu, Yi Chen, Yongwei Zhao, Yifan Hao et al.ASPLOS 2026
Builds on3
- ACT: designing sustainable computer systems with an architectural carbon modeling toolUdit Gupta, Mariam Elgamal, Gage Hills, Gu-Yeon Wei et al.ISCA 2022 · 176 citations
- Chiplet actuary: a quantitative cost model and multi-chiplet architecture explorationYinxiao Feng, Kaisheng MaDAC 2022 · 81 citations
- Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC OptionsJinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan et al.DAC 2021 · 20 citations
Related papers
- CAPA: Manufacturing Carbon Estimation for Advanced-Packaged ArchitecturesJingyang Liu, Gwenith Bowker-Bafna, Yuke Zhang, Natalie Enright JergerISCA 2026
- ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSIChetan Choppali Sudarshan, Nikhil Matkar, Sarma B. K. Vrudhula, Sachin S. Sapatnekar et al.HPCA 2024 · 54 citations
- FOCAL: A First-Order Carbon Model to Assess Processor SustainabilityLieven EeckhoutASPLOS 2024 · 30 citations
- Unveiling the Uncertainty in Embodied and Operational Carbon of Large AI Models through a Probabilistic Carbon Accounting ModelXiaoyang Zhang, Fang He, Yang Deng, Dan WangNeurIPS 2025 · 3 citations
- CORDOBA: Carbon-Efficient Optimization Framework for Computing SystemsMariam Elgamal, Doug Carmean, Elnaz Ansari, Okay Zed et al.HPCA 2025 · 16 citations
